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Patent Searching and Data


Title:
BIODEGRADABLE RESIN COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2021/201186
Kind Code:
A1
Abstract:
A biodegradable resin composition containing a resin having a glass transition temperature not higher than 40°C and polysaccharides including an amino sugar, wherein the contained amount of the polysaccharides including the amino sugar is 0.01-30 wt%. The present invention can provide a biodegradable resin composition that has a rapid biodegradation rate and a high biodegradation degree.

Inventors:
IKEDA YUTA (JP)
KATO SATOSHI (JP)
NOGUCHI HIROSHI (JP)
MIYAMACHI REMI (JP)
Application Number:
PCT/JP2021/014071
Publication Date:
October 07, 2021
Filing Date:
March 31, 2021
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08L5/00; C08L67/02; C08L101/12; C08L101/16
Foreign References:
CN110549717A2019-12-10
JP2007077232A2007-03-29
JPH11269359A1999-10-05
CN106492273A2017-03-15
JPH0543747A1993-02-23
JPH10328685A1998-12-15
JPH08246243A1996-09-24
JP2000160466A2000-06-13
JPH101855A1998-01-06
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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