Title:
BIODEGRADABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2006/059606
Kind Code:
A1
Abstract:
Disclosed is a biodegradable resin composition having thermoplasticity, flexibility and practically sufficient mechanical physical properties which hardly agglutinates at a temperature not less than the softening point. This biodegradable resin composition also has excellent heat resistance which compositions composed of conventional biodegradable resins such as conventional starches and conventional polylactic acids have not attained. Also disclosed is a molded article made of such a biodegradable resin composition. Specifically disclosed is a biodegradable resin composition composed of a modified epoxy compound which is obtained by processing a biodegradable resin and an epoxy compound with an organic peroxide.
Inventors:
YAMAGUCHI EIKO (JP)
Application Number:
PCT/JP2005/021895
Publication Date:
June 08, 2006
Filing Date:
November 29, 2005
Export Citation:
Assignee:
YAMAGUCHI EIKO (JP)
International Classes:
C08L3/00; C08G59/40; C08L63/00; C08L67/04; C08L101/16
Domestic Patent References:
| WO1997003130A1 | 1997-01-30 |
Foreign References:
| JP2000095898A | 2000-04-04 | |||
| JP2002167520A | 2002-06-11 | |||
| JP2002037995A | 2002-02-06 | |||
| JP2004107479A | 2004-04-08 | |||
| JP2004010693A | 2004-01-15 | |||
| JP2000219803A | 2000-08-08 |
Attorney, Agent or Firm:
Asahina, Sohta (2-22 Tanimachi 2-chome, Chuo-k, Osaka-shi Osaka 12, JP)
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