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Title:
BISIMIDE COMPOUNDS, POLYIMIDE RESIN COMPOSITION PREPARED THEREFROM, AND CARBON FIBER-REINFORCED POLYIMIDE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/1992/012967
Kind Code:
A1
Abstract:
A polyimide resin composition for molding, which comprises a polyimide resin and an aromatic bisimide compound and has a melt flowability and an excellent processability in addition to the heat resistance inherent in polyamide; a carbon fiber-reinforced polyimide resin composition which comprises a polyimide resin and carbon fibers coated with an aromatic bisimide compound and has excellent mechanical strengths; and novel bisimide compounds represented by general formula (I), which are very useful as the aromatic bisimide compounds in the above resin compositions, wherein X represents a direct bond, C�1? to C�10? divalent hydrocarbyl, hexafluoroisopropylidene, carbonyl, thio or sulfonyl; Y�1? to Y�4? represent each independently hydrogen, lower alkyl, lower alkoxy, chlorine or bromine; and R represents a divalent group selected from the group consisting of monocyclic aromatic groups, fused polycyclic aromatic groups, and nonfused polycyclic aromatic groups wherein aromatic groups are linked together directly or through cross-linking member(s).

Inventors:
OHTA MASAHIRO (JP)
MATSUYAMA AKIO (JP)
SENOUE EIJI (JP)
KUWANO FUMIAKI (JP)
YASUI OSAMU (JP)
YOSHIDA YASUNORI (JP)
Application Number:
PCT/JP1992/000039
Publication Date:
August 06, 1992
Filing Date:
January 20, 1992
Export Citation:
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Assignee:
MITSUI TOATSU CHEMICALS (JP)
International Classes:
C07D209/48; C07D209/66; C07D487/04; C08G73/10; C08G73/12; C08K5/3417; C08K9/04; C08L79/08; C09D179/08; (IPC1-7): C07D209/48; C07D209/66; C08K5/3417; C08L79/08
Foreign References:
JPS59147046A1984-08-23
US4276407A1981-06-30
US4024110A1977-05-17
Other References:
Kobunshi Ronbunshu, Vol, 35, No. 8, 1978 (Tokyo), SATO, M. etc., p. 501-7.
See also references of EP 0523240A4
Attorney, Agent or Firm:
Mogami, Shotaro (8-1 Akasaka 1-chom, Minato-ku Tokyo 107, JP)
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