Title:
BLACK RESIN COMPOSITION, POLYIMIDE WITH BLACK RESIN CURED FILM AND PRODUCTION METHOD THEREFOR, AND FLEXIBLE PRINTED WIRING BOARD USING BLACK RESIN CURED FILM
Document Type and Number:
WIPO Patent Application WO/2017/078152
Kind Code:
A1
Abstract:
Provided is a production method for a polyimide with a black resin cured film, the method comprising a step for obtaining a black resin cured film by curing a black resin composition on a polyimide, wherein: the step for obtaining a black resin cured film includes a step for processing the black resin composition with a predetermined spray impact; and the distance to an end of a top portion of the black resin from a point where a line that is perpendicular with respect to the surface of the polyimide and that passes through a substrate-adhered end part between the black resin cured film and the polyimide intersects the top portion of the black resin cured film, is not more than 25 µm.
Inventors:
KOGISO TETSUYA (JP)
KODA TOMOHIRO (JP)
KIDO MASAYOSHI (JP)
KODA TOMOHIRO (JP)
KIDO MASAYOSHI (JP)
Application Number:
PCT/JP2016/082839
Publication Date:
May 11, 2017
Filing Date:
November 04, 2016
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
B05D3/10; B05D7/04; B32B27/20; B32B27/34; C08J7/043; C08J7/046; C08J7/05; H05K3/28
Domestic Patent References:
| WO2013111481A1 | 2013-08-01 | |||
| WO2016158114A1 | 2016-10-06 | |||
| WO2016103994A1 | 2016-06-30 |
Foreign References:
| JP2010256891A | 2010-11-11 | |||
| JP2015200774A | 2015-11-12 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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