Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
BLACKENED SURFACE-TREATED COPPER FOIL, METHOD FOR MANUFACTURING BLACKENED SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE AND FLEXIBLE PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2014/133164
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a copper foil for a printed circuit board, the copper foil having: a blackened surface capable of improving CCD visibility during terminal connection processing and precision of flexible printed circuit board AOI detection; an appropriate roughness suitable for manufacturing flexible printed circuit boards; and favorable etching properties. To achieve said purpose, a blackened surface-treated copper foil, etc. for manufacturing flexible printed circuit boards is used, the foil being characterized in that the roughened surface of the surface-treated copper foil with a roughened surface is a black roughened surface for which the maximum high-low difference of the undulations (Wmax) is 1.2 µm or less and which is provided with a color tone having a L*a*b* color system lightness (L*) of 30 or less.

Inventors:
MIZOGUCHI MISATO (JP)
OBATA SHINICHI (JP)
TATEOKA AYUMU (JP)
HIRAOKA SHINYA (JP)
HASHIGUCHI TAKASHI (JP)
Application Number:
JP2014/055173
Publication Date:
September 04, 2014
Filing Date:
February 28, 2014
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
C25D7/06; C25D3/38; H05K1/09
Domestic Patent References:
WO2012046804A12012-04-12
WO2007105635A12007-09-20
Foreign References:
JP2009176768A2009-08-06
JP2004263300A2004-09-24
JP2009004423A2009-01-08
JP2010013738A2010-01-21
Attorney, Agent or Firm:
YOSHIMURA, KATSUHIRO (JP)
Katsuhiro Yoshimura (JP)
Download PDF: