BLACKENING SURFACE TREATED COPPER FOIL AND ELECTROMAGNETIC WAVE SHIELDING CONDUCTIVE MESH FOR FRONT PANEL OF PLASMA DISPLAY USING THE BLACKENING SURFACE TREATED COPPER FOIL

WIPO Patent Application WO/2007/007870

A1

A blackening surface treated copper foil capable of improving a phenomenon of causing clouding of the surface of an adhesive layer exposed between mesh circuits on completion of etching of a conductive mesh used for shielding a plasma display panel against an electromagnetic wave. The blackening surface treated copper foil is used which is a surface treated copper foil having a blackening treated surface provided on the surface of an untreated electrolytic copper foil, characterized in that the untreated electrolytic copper foil has a surface of which surface roughness Ra is up to 45 nm as measured with a three-dimensional surface structure analysis microscope, and the surface is provided with a blackening treated surface. The surface of the untreated electrolytic copper foil provided with a blackening treated surface more preferably has a surface roughness Rz of up to 850 nm as measured with a three-dimensional surface structure analysis microscope.

JP2011151260	COOLING STRUCTURE
WO/2007/101643	MINERAL COMPOSITION

HIGUCHI TSUTOMU (JP)
MATSUDA MITSUYOSHI (JP)

PCT/JP2006/314031

January 18, 2007

July 14, 2006

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MITSUI MINING & SMELTING CO (JP)
HIGUCHI TSUTOMU (JP)
MATSUDA MITSUYOSHI (JP)

H05K9/00; C25D1/04; C25D7/06; G09F9/00

JP2000286594A	2000-10-13
JP2003201597A	2003-07-18
JP2004145063A	2004-05-20
JP2005139544A	2005-06-02
JP2004035918A	2004-02-05
JP2004162172A	2004-06-10
JP2004263289A	2004-09-24

YOSHIMURA, Katsuhiro (Patent Office Omiya F Bldg., 5-4, Sakuragicho 2-chome, Omiya-k, Saitama-shi Saitama 54, JP)

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