Title:
BLOCK COPOLYMER
Document Type and Number:
WIPO Patent Application WO/2023/058385
Kind Code:
A1
Abstract:
Provided are: a block copolymer which has a small dielectric dissipation factor and excellent mechanical properties including elongation and strength; a polyimide resin which is produced by imidizing the block copolymer; a composition for resin film formation use, from which a resin film containing the block copolymer can be formed; and a method for producing a resin film using the composition for resin film formation use. A block copolymer is used, which contains a block derived from a polyamide macromonomer and/or a block derived from a polyimide macromonomer, in which the block derived from a polyamide macromonomer and/or the block derived from a polyimide macromonomer is produced by the copolymerization of: a macromonomer that is a polyamide macromonomer and/or a polyimide macromonomer; a tetracarboxylic acid dianhydride and/or a dicarboxylic acid that is a reaction product of a tetracarboxylic acid dianhydride with an alcohol; and a diamine compound. In the block copolymer, the weight average molecular weight of the block derived from a polyamide macromonomer and/or the block derived from a polyimide macromonomer is 1500 to 30000 inclusive.
Inventors:
EBISAWA KAZUAKI (JP)
Application Number:
PCT/JP2022/033381
Publication Date:
April 13, 2023
Filing Date:
September 06, 2022
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
C08G73/10; G03F7/037
Domestic Patent References:
| WO2003060010A1 | 2003-07-24 |
Foreign References:
| JP2005266757A | 2005-09-29 | |||
| JP2002040658A | 2002-02-06 | |||
| CN1563148A | 2005-01-12 |
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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