BOARD BUILDING MATERIAL, BOARD BUILDING MATERIAL PRODUCING METHOD, BOARD BUILDING MATERIAL INSTALLATION METHOD

WIPO Patent Application WO/2005/106156

A1

Openings in a board building material are formed by a large number of recesses (13) or by through-holes (12) and the recesses (13). The bottom surface (16) of each recess (13) is formed as a surface into which an engagement member (70) can be screwed or driven. The color of the bottom surfaces of the recesses is set to brightness relatively lower than the brightness of the color of a board surface (18). The base material of the board building material is a gypsum board, and the bottom surfaces of the recesses are formed by gypsum board base paper. In such a board building material, the region in which the engagement members are screwed or driven can be secured without impairing regularity, uniformity, or design features of the openings, and in addition, puttying etc. of portions where the engagement members are exposed can be eliminated.

HASEGAWA TOMOYA (JP)
AMAGAI YASUYUKI (JP)
OKAZAKI SHOICHI (JP)
WADA MASAHIRO (JP)

PCT/JP2005/008463

November 10, 2005

April 27, 2005

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YOSHINO GYPSUM CO (JP)
HASEGAWA TOMOYA (JP)
AMAGAI YASUYUKI (JP)
OKAZAKI SHOICHI (JP)
WADA MASAHIRO (JP)

B28B11/10; B32B17/02; E04B9/00; E04B9/04; E04C2/04; E04B1/86; E04C2/26; E04F13/08; E04F13/14; (IPC1-7): E04C2/26; E04B1/86; E04B9/04; E04F13/08; E04F13/14

JPS55138556A	1980-10-29
JPS366739Y1	1961-04-07
JP2003247317A	2003-09-05
JPH10121601A	1998-05-12
JP2001132132A	2001-05-15
JPS6274296U	1987-05-12
JPS5080221U	1975-07-10
JPH052395A	1993-01-08
JP2003154514A	2003-05-27
JPH11170793A	1999-06-29
JP2003154514A	2003-05-27

See also references of EP 1757749A4

Shimazoe, Yoshihiko (2-17 Sotokanda 2-chom, Chiyoda-ku Tokyo, JP)

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