BOARD MATERIAL FOR MUSICAL INSTRUMENTS, AND STRING INSTRUMENT

WIPO Patent Application WO/2018/079448

A1

This board material for musical instruments is provided with: a first base material layer; and a pair of first reinforcing layers that are laminated on both surfaces of the first base material layer. The pair of first reinforcing layers contain fibers and a binder; and the fibers are polyparaphenylene benzobisoxazole fibers, liquid crystal polyester fibers, aramid fibers, polyarylate fibers, ultra high molecular weight polyethylene fibers, polyethylene naphthalate fibers or glass fibers. It is preferable for this board material for musical instruments that the first base material layer is mainly composed of wood. This board material for musical instruments may be configured such that the first base material layer is a porous layer that is mainly composed of a synthetic resin. It is preferable for this board material for musical instruments that second base material layers are provided on the outer surfaces of the pair of first reinforcing layers and the main component of the second base material layers is the same as the main component of the first base material layer. It is also preferable for this board material for musical instruments that second reinforcing layers are provided on the outer surfaces of the second base material layers and the main component of the second reinforcing layers is the same as the main component of the first reinforcing layers.

MATSUDA ASUMI (JP)
MIYATA TOMOYA (JP)
KOBAYASHI KAZUYUKI (JP)

PCT/JP2017/038052

May 03, 2018

October 20, 2017

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YAMAHA CORP (JP)

G10D3/02; B27M3/00; B32B27/12; G10C3/06; G10D1/02; G10D1/08

JPH09160539A	1997-06-20
JPS57187492U	1982-11-27
JPS5664394A	1981-06-01

AMANO Kazunori (JP)

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