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Title:
BOARD FOR MOUNTING ELECTRONIC COMPONENT, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/211992
Kind Code:
A1
Abstract:
This board has an insulation layer 11, an adhesion layer 200 that is provided to the insulation layer 11, and a metal layer 220 that is provided to the adhesion layer 200. The adhesion layer 200 has an adhesion main body layer 210 and an anchor body 215 protruding from a front surface of the adhesion main body layer 210, or has an oxidation-reduction layer 250.

Inventors:
SASAKI BEJI (JP)
Application Number:
PCT/JP2018/017503
Publication Date:
November 22, 2018
Filing Date:
May 02, 2018
Export Citation:
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Assignee:
FREESIA MACROSS CORP (JP)
International Classes:
H05K3/22; H01L23/12
Foreign References:
JP2002190671A2002-07-05
JP2004179440A2004-06-24
JP2003273509A2003-09-26
JP2002060965A2002-02-28
JP2001068816A2001-03-16
JP2012169600A2012-09-06
Other References:
See also references of EP 3637965A4
Attorney, Agent or Firm:
OHNO Seiji et al. (JP)
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