Title:
BOILING COOLER AND METHOD FOR MANUFACTURING BOILING COOLER
Document Type and Number:
WIPO Patent Application WO/2024/048107
Kind Code:
A1
Abstract:
A boiling cooler (100) comprises: a boiling unit (10) that boils a refrigerant (5) through heat-exchange with a heating element (HS); and a condensing unit (20) that condenses the refrigerant vaporized by the boiling unit and returns the same to the boiling unit. The boiling unit includes a heating element attaching surface (11a), and a boiling surface part (13) that is provided in a surface (11b) opposite to the attaching surface and that comes into contact with the refrigerant. The boiling surface part includes a groove portion (14) that extends linearly and has an irregular recess-projection shape caused by melting and solidification of a material by energy beam machining.
Inventors:
YAMANAKA KIYOAKI (JP)
ANDO KENJI (JP)
TANABE AKIHIRO (JP)
ANDO KENJI (JP)
TANABE AKIHIRO (JP)
Application Number:
PCT/JP2023/026464
Publication Date:
March 07, 2024
Filing Date:
July 19, 2023
Export Citation:
Assignee:
SUMITOMO PRECISION PROD CO (JP)
International Classes:
F28F13/02; B23K26/354; F28D15/02; F28D15/04; H01L23/427
Domestic Patent References:
| WO2022114094A1 | 2022-06-02 | |||
| WO2021145332A1 | 2021-07-22 |
Foreign References:
| CN112923762A | 2021-06-08 | |||
| JP2017015269A | 2017-01-19 |
Attorney, Agent or Firm:
MIYAZONO, Hirokazu (JP)
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