Title:
BOILING AND COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/147265
Kind Code:
A1
Abstract:
Provided is a low-cost and lightweight boiling and cooling device with which entrance of a liquid refrigerant into a condensation portion is controlled. The boiling and cooling device of the present invention comprises: an accommodating portion which accommodates the liquid refrigerant; a communication chamber whose inner space communicates with an inner space of the accommodating portion; and the condensation portion which protrudes from a side of the communication chamber. The communication chamber is a plate-shaped member facing an opening of the condensation portion and disposed away from an end of the condensation portion. The communication chamber comprises an induction plate which induces the boiling liquid refrigerant to an upper part of the opening of the condensation portion, a communication hole being formed at an upper part of the induction plate. An inner fin (a heat transmission member) is disposed only at a side end in an inner space of the condensation portion.
Inventors:
HARIU SATOSHI (JP)
YOSHIHARA KOJI (JP)
YAMASAKI TAKAFUMI (JP)
YOSHIHARA KOJI (JP)
YAMASAKI TAKAFUMI (JP)
Application Number:
PCT/JP2012/001732
Publication Date:
November 01, 2012
Filing Date:
March 13, 2012
Export Citation:
Assignee:
TOYOTA JIDOSHOKKI KK (JP)
HARIU SATOSHI (JP)
YOSHIHARA KOJI (JP)
YAMASAKI TAKAFUMI (JP)
HARIU SATOSHI (JP)
YOSHIHARA KOJI (JP)
YAMASAKI TAKAFUMI (JP)
International Classes:
H01L23/427; F28D15/02; H05K7/20
Foreign References:
| JP2001028415A | 2001-01-30 | |||
| JP2000205769A | 2000-07-28 | |||
| JP2010080507A | 2010-04-08 |
Attorney, Agent or Firm:
OHKAWA, HIROSHI (JP)
Okawa 宏 (JP)
Okawa 宏 (JP)
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Claims: