Title:
BONDED BODY AND ACOUSTIC WAVE ELEMENT
Document Type and Number:
WIPO Patent Application WO/2020/079959
Kind Code:
A1
Abstract:
[Problem] To securely and stably bond a piezoelectric material substrate 1A onto a support substrate 3 via a bonding layer that comprises a silicon oxide which has a low oxygen ratio. [Solution] A bonded body 8A includes: the support substrate 3; the piezoelectric material substrate 1A; a first bonding layer 4A which is provided on the support substrate 3 and has a composition of Si(1
−
x)Ox (0.008≤x≤0.408); a second bonding layer 2A which is provided on the piezoelectric material substrate 1A and has a composition of Si(1
−
y)Oy (0.008≤y≤0.408); and an amorphous layer 7 which is provided between the first bonding layer 4A and the second bonding layer 2A. The amorphous layer 7 has an oxygen ratio that is higher than the oxygen ratio of the first bonding layer 4A and the oxygen ratio of the second bonding layer 2A.
More Like This:
| JPH09162697 | SURFACE ACOUSTIC WAVE CONVOLVER |
| JPH11168350 | LATERAL MULTIPLEX MODE SAW FILTER |
Inventors:
UNO YUDAI (JP)
GOTO MASASHI (JP)
TAI TOMOYOSHI (JP)
GOTO MASASHI (JP)
TAI TOMOYOSHI (JP)
Application Number:
PCT/JP2019/033130
Publication Date:
April 23, 2020
Filing Date:
August 23, 2019
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
International Classes:
H03H9/25
Domestic Patent References:
| WO2018180827A1 | 2018-10-04 | |||
| WO2017134980A1 | 2017-08-10 |
Foreign References:
| JP2004343359A | 2004-12-02 |
Attorney, Agent or Firm:
HOSODA Masutoshi et al. (JP)
Download PDF:
Previous Patent: BONDED BODY AND ACOUSTIC WAVE ELEMENT
Next Patent: IMAGING DEVICE AND SOLID-STATE IMAGING DEVICE
Next Patent: IMAGING DEVICE AND SOLID-STATE IMAGING DEVICE