Title:
BONDED BODY AND ACOUSTIC WAVE ELEMENT
Document Type and Number:
WIPO Patent Application WO/2021/002046
Kind Code:
A1
Abstract:
[Problem] To provide a bonded body which enables improvement of the Q value of an acoustic wave element. [Solution] A bonded body 9A according to the present invention is provided with a supporting substrate 6, a piezoelectric material substrate 1A, and a multilayer film 2 that is arranged between the supporting substrate and the piezoelectric material substrate. The multilayer film 2 has a structure wherein first layers 2a having a composition represented by SiOx and second layers 2b composed of a metal oxide are alternately stacked; and x in SiOx is a value larger than 2.
Inventors:
ASAI KEIICHIRO (JP)
HATTORI RYOSUKE (JP)
TAI TOMOYOSHI (JP)
UNO YUDAI (JP)
HATTORI RYOSUKE (JP)
TAI TOMOYOSHI (JP)
UNO YUDAI (JP)
Application Number:
PCT/JP2020/007096
Publication Date:
January 07, 2021
Filing Date:
February 21, 2020
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
International Classes:
H03H9/25
Domestic Patent References:
| WO2018016169A1 | 2018-01-25 | |||
| WO2018180827A1 | 2018-10-04 |
Foreign References:
| JP2019102883A | 2019-06-24 | |||
| JP2006526919A | 2006-11-24 |
Attorney, Agent or Firm:
HOSODA Masutoshi et al. (JP)
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