Title:
BONDED BODY AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/022933
Kind Code:
A1
Abstract:
This bonded body (1) is obtained by bonding a first member (2) and a second member (3), which is formed of a material different from that of the first member (2), with each other with a bonding layer (4) being interposed therebetween. The number of air bubbles having a void area of 1.5 × 10-3 μm2 or more in the range of 13 μm in a cross-section of the bonding interface between the first member (2) and the bonding layer (4) is 100 or less.
Inventors:
SAITO TAIGA (JP)
NAGATA KAZUYA (JP)
NAGATA KAZUYA (JP)
Application Number:
PCT/JP2014/071186
Publication Date:
February 19, 2015
Filing Date:
August 11, 2014
Export Citation:
Assignee:
ASAHI KASEI CHEMICALS CORP (JP)
International Classes:
B29C65/16; B29C45/14
Domestic Patent References:
| WO2009069542A1 | 2009-06-04 |
Foreign References:
| JP2009269401A | 2009-11-19 | |||
| JP2010046831A | 2010-03-04 | |||
| JP2009113314A | 2009-05-28 | |||
| JP2011213108A | 2011-10-27 | |||
| JP2013071452A | 2013-04-22 | |||
| JP2009039987A | 2009-02-26 | |||
| JP2013244614A | 2013-12-09 | |||
| JP4771387B2 | 2011-09-14 |
Other References:
See also references of EP 3034277A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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