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Patent Searching and Data


Title:
METAL/CERAMIC BONDED BODY, DIAPHRAGM VACUUM GAUGE, BONDING METHOD FOR METAL AND CERAMIC, AND PRODUCTION METHOD FOR DIAPHRAGM VACUUM GAUGE
Document Type and Number:
WIPO Patent Application WO/2015/105148
Kind Code:
A1
Abstract:
A metal/ceramic bonded body comprising: a metal member; a ceramic member (11); a bonding layer (21) comprising enamel and bonding the metal member and the ceramic member; a conductive layer (22) constituting the outer surface of the ceramic member and covered by the bonding layer; and a terminal layer (23) positioned at sites (11d, 11e) on the outer surface of the ceramic layer that are separated from the metal member. The conductive layer (22) has a higher electric conductivity than the bonding layer (21). The bonding layer (21) is positioned between the metal member and the terminal layer (23).

Inventors:
TAKAHASHI NAOKI (JP)
YOSHIDA KEISUKE (JP)
Application Number:
PCT/JP2015/050375
Publication Date:
July 16, 2015
Filing Date:
January 08, 2015
Export Citation:
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Assignee:
ULVAC INC (JP)
International Classes:
C04B37/02; G01L9/00; G01L21/00
Foreign References:
JPH06271361A1994-09-27
JP2009234832A2009-10-15
JP2009210482A2009-09-17
JP2002500351A2002-01-08
JP2014196976A2014-10-16
Attorney, Agent or Firm:
ONDA, Makoto et al. (JP)
Makoto Onda (JP)
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