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Patent Searching and Data


Title:
BONDED BODY AND ELASTIC WAVE ELEMENT
Document Type and Number:
WIPO Patent Application WO/2017/163729
Kind Code:
A1
Abstract:
[Problem] When providing a bonding layer on a support substrate formed from a ceramic and bonding the bonding layer and a piezoelectric single crystal substrate together, to improve bonding strength between the piezoelectric single crystal and the bonding layer and to prevent separation between the bonding layer and the support substrate. [Solution] This bonded body 8 comprises: a support substrate 1 which is formed from a ceramic; a bonding layer 3A which, provided on a surface 1a of the support substrate 1, comprises at least one material selected from the group consisting of mullite, alumina, tantalum pentoxide, titanium oxide and niobium pentoxide; and a piezoelectric single crystal substrate 6A which is bonded to the bonding layer 3A. The arithmetic average roughness Ra of the surface 1a of the support substrate 1 is 0.5-5.0 nm.

Inventors:
TAI TOMOYOSHI (JP)
GOTO MASASHI (JP)
UNO YUDAI (JP)
KANEKO SHINYA (JP)
Application Number:
PCT/JP2017/006476
Publication Date:
September 28, 2017
Filing Date:
February 22, 2017
Export Citation:
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Assignee:
NGK INSULATORS LTD (JP)
International Classes:
H03H3/08; H01L41/09; H01L41/187; H01L41/313; H01L41/337; H03H9/25
Domestic Patent References:
WO2014192597A12014-12-04
WO2014010696A12014-01-16
WO2013146374A12013-10-03
Foreign References:
JP2015145054A2015-08-13
Attorney, Agent or Firm:
HOSODA Masutoshi et al. (JP)
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