Title:
BONDED BODY, INSULATED CIRCUIT BOARD WITH HEAT SINK, AND HEAT SINK
Document Type and Number:
WIPO Patent Application WO/2020/096040
Kind Code:
A1
Abstract:
Provided is a bonded body that can suppress a decrease in thermal conductivity of an aluminum member even if the aluminum member comprising an Al-Mn type alloy and a copper member comprising copper or a copper alloy are bonded. A bonded body (30) for which an aluminum member (31) comprising an aluminum alloy and a copper member (13) comprising copper or a copper alloy undergo solid phase diffusion bonding, wherein the aluminum member (31) is configured by an Al-Mn type alloy containing Mn, and when the Mn concentration C0 for the entire aluminum member (31) is in a range of 0.4 mass% to 1.5 mass% [inclusive], the Mn concentration in a region within the aluminum member (31) for which the precipitate is excluded is solution Mn concentration C1, and the value for which the solution Mn concentration C1 is subtracted from the Mn concentration C0 of the overall aluminum member (31) is the precipitated Mn concentration C2, the ratio C1/C2 of the solution Mn concentration C1 and the precipitated Mn concentration C2 is in a range of 0.1 to 2.7 [inclusive].
More Like This:
| JPH0491499 | HYBRID INTEGRATED CIRCUIT DEVICE BOARD |
| JPWO2018047485 | Power module and inverter device |
| JPH11251495 | ELECTRONIC CIRCUIT DEVICE |
Inventors:
TERASAKI NOBUYUKI (JP)
Application Number:
PCT/JP2019/043855
Publication Date:
May 14, 2020
Filing Date:
November 08, 2019
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H01L23/36; C22C21/00; H01L23/12; H01L23/373; H01L23/40; H05K1/02; C22F1/00; C22F1/04
Domestic Patent References:
| WO2011155379A1 | 2011-12-15 |
Foreign References:
| JP2014107516A | 2014-06-09 | |||
| JP2016176098A | 2016-10-06 | |||
| JP2016208009A | 2016-12-08 | |||
| JP2016208010A | 2016-12-08 | |||
| JP2017174927A | 2017-09-28 | |||
| JP2014099596A | 2014-05-29 | |||
| JP2016063145A | 2016-04-25 | |||
| JP2018210823A | 2018-11-08 | |||
| JP3171234B2 | 2001-05-28 | |||
| JP2004288828A | 2004-10-14 | |||
| JP2009224571A | 2009-10-01 | |||
| JP2012169318A | 2012-09-06 | |||
| JP2014099596A | 2014-05-29 |
Other References:
See also references of EP 3879568A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
Download PDF: