Title:
COPPER/CERAMIC BONDED BODY AND INSULATED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/224946
Kind Code:
A1
Abstract:
In the copper/ceramic bonded body according to the present invention, copper members (12), (13), respectively, are bonded to one side and the other side of a ceramic member (11). Active metal nitride layers (21), (31) are formed on the ceramic-member (11) sides of the copper members (12), (13). The area ratios A1, A2 of active metal compounds containing Si and an active metal in regions (E1), (E2) measuring 10 μm from the active metal nitride layers (21), (31) toward the copper members (12), (13) are 10% or lower, and the ratio A1/A2 of the area ratio A1 of active metal compounds on the one side and the area ratio A2 of active metal compounds on the other side is within a range from 0.7 to 1.4.
Inventors:
TERASAKI NOBUYUKI (JP)
Application Number:
PCT/JP2022/018126
Publication Date:
October 27, 2022
Filing Date:
April 19, 2022
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C04B37/02; H01L23/13; H05K1/02
Domestic Patent References:
| WO2020203787A1 | 2020-10-08 | |||
| WO2015046280A1 | 2015-04-02 | |||
| WO2017213207A1 | 2017-12-14 | |||
| WO2018003845A1 | 2018-01-04 |
Foreign References:
| JP2021017390A | 2021-02-15 | |||
| JP2021031315A | 2021-03-01 | |||
| JP2021070220A | 2021-05-06 | |||
| JP3211856B2 | 2001-09-25 | |||
| JP2018008869A | 2018-01-18 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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