Title:
COPPER/CERAMIC BONDED BODY AND INSULATED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2023/286862
Kind Code:
A1
Abstract:
This copper/ceramic bonded body (10) comprises a copper member (12, 13) composed of copper or a copper alloy, and a ceramic member (11). The copper member (12, 13) and the ceramic member (11) are bonded to each other. At a bonding interface between the ceramic member (11) and the copper member (12, 13), an active metal compound layer (21) is formed on the ceramic member (11) side. In a field of view that is on a cross section taken along the direction in which the ceramic member (11) and the copper member (12, 13) are laminated, the field of view extending by 200 µm in the width direction of the bonding interface and by 10 µm in the direction from the surface of the active metal compound layer (21) to the copper member (12, 13) side, an area A of the active metal-containing precipitated substance is configured to be not more than 360 µm2, and the ratio A/B between the area A of the active metal-containing precipitated substance and an area B of a Ag concentrated phase where the Ag concentration is at least 10 at%, is configured to fall within the range of 0.03-0.8.
Inventors:
TERASAKI NOBUYUKI (JP)
Application Number:
PCT/JP2022/027881
Publication Date:
January 19, 2023
Filing Date:
July 15, 2022
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C04B37/02; B23K1/00; B23K1/19; H01L23/13; H05K3/38
Domestic Patent References:
| WO2021200242A1 | 2021-10-07 | |||
| WO2022085654A1 | 2022-04-28 | |||
| WO2013002407A1 | 2013-01-03 |
Foreign References:
| JP2009234895A | 2009-10-15 | |||
| JPH05194054A | 1993-08-03 | |||
| JPH10178270A | 1998-06-30 | |||
| JP2013211545A | 2013-10-10 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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