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Title:
COPPER/CERAMIC BONDED BODY, INSULATING CIRCUIT BOARD, COPPER/CERAMIC BONDED BODY PRODUCTION METHOD, AND INSULATING CIRCUIT BOARD PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2019/146464
Kind Code:
A1
Abstract:
This copper/ceramic bonded body is constituted by a copper member (12), comprising copper or a copper alloy, and a ceramic member (11), comprising aluminum oxide, which are bonded to each other. A magnesium oxide layer (31) is formed between the copper member (12) and the ceramic member (11) on the ceramic member (11) side. A Mg solid solution layer (32) in which Mg is solid-solved in a Cu matrix phase is formed between the magnesium oxide layer (31) and the copper member (12). One or more active metals selected from Ti, Zr, Nb, and Hf are present in the Mg solid solution layer (32).

Inventors:
TERASAKI NOBUYUKI (JP)
Application Number:
PCT/JP2019/001045
Publication Date:
August 01, 2019
Filing Date:
January 16, 2019
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C04B37/02; H01L23/12; H01L23/13; H01L23/36
Foreign References:
JP2005305526A2005-11-04
JP2017183716A2017-10-05
JPS63220987A1988-09-14
JP2018010965A2018-01-18
JP2018227472A2018-12-04
JPH04162756A1992-06-08
JP3211856B22001-09-25
JP4375730B22009-12-02
Other References:
See also references of EP 3744705A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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