Title:
BONDED BODY MANUFACTURING METHOD AND BONDED BODY
Document Type and Number:
WIPO Patent Application WO/2021/199613
Kind Code:
A1
Abstract:
This bonded body manufacturing method comprises: a preparation step for interposing a glass-containing sealing material 6 between a highly thermal conductive substrate 2 and a glass substrate 3; and a joining step for forming a sealing layer 4 by irradiating the sealing material 6 with a laser beam L. The joining step comprises: a first heating step for subjecting said sealing material 6 to preheating, by way of irradiation with the laser beam L, either at a temperature lower than the softening temperature of the sealing material 6 or at a temperature at which the sealing material 6 does not get softened or become fluid; and a second heating step for, after the first heating step, heating said sealing material 6, by way of irradiation with the laser beam L, either at a temperature equal to or higher than the softening temperature of the sealing material 6 or at a temperature at which the sealing material 6 gets softened and becomes fluid.
Inventors:
SHIRAGAMI TORU (JP)
Application Number:
PCT/JP2021/002228
Publication Date:
October 07, 2021
Filing Date:
January 22, 2021
Export Citation:
Assignee:
NIPPON ELECTRIC GLASS CO (JP)
International Classes:
B23K26/57; C03C27/04; H01L23/02; H01L23/10
Domestic Patent References:
| WO2020050031A1 | 2020-03-12 | |||
| WO2017212828A1 | 2017-12-14 |
Foreign References:
| JP2013239609A | 2013-11-28 | |||
| JP2015023263A | 2015-02-02 | |||
| JP2013021079A | 2013-01-31 | |||
| JP2017212251A | 2017-11-30 | |||
| JP2013119501A | 2013-06-17 | |||
| JP2001326290A | 2001-11-22 |
Attorney, Agent or Firm:
SHIROMURA Kunihiko et al. (JP)
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