Title:
BONDED BODY AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2023/189188
Kind Code:
A1
Abstract:
The objective of the present invention is to provide a bonded body which has excellent flexural modulus and bonding strength and in which a decrease in transparency due to an increase in haze during the generation of water vapor is suppressed. A bonded body according to the present invention includes a plurality of molded bodies made of a thermoplastic resin and a bonding layer that bonds the molded bodies together, wherein the bonding layer comprises at least one cyclic olefin polymer, and a solvent component with a predetermined boiling point range, and contains the solvent component with a predetermined boiling point range within a predetermined trace concentration range.
Inventors:
CHIBA DAIDO (JP)
NISHIOKA HIROYA (JP)
NISHIOKA HIROYA (JP)
Application Number:
PCT/JP2023/007911
Publication Date:
October 05, 2023
Filing Date:
March 02, 2023
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
B32B27/00; B29C65/48; B32B7/12; C09J5/06; C09J123/02
Domestic Patent References:
| WO2009131070A1 | 2009-10-29 |
Foreign References:
| JP2004058339A | 2004-02-26 | |||
| JPH10286911A | 1998-10-27 | |||
| JP2017156531A | 2017-09-07 | |||
| JP2005080569A | 2005-03-31 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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