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Patent Searching and Data


Title:
BONDED BODY AND METHOD FOR PRODUCING BONDED BODY
Document Type and Number:
WIPO Patent Application WO/2017/002973
Kind Code:
A1
Abstract:
A bonded body is provided with: an optical element 10 that is a first member formed from a thermoplastic resin; and a substrate 20 that is a second member formed from an inorganic material. The bonded body comprises a molecular adhesive layer 30 between the optical element 10 and the substrate 20. The optical element 10 is chemically bonded to the substrate 20 via the molecular adhesive layer 30 by melting locally with heat from a wiring-type electric heating unit 90 arranged at the boundary or in the vicinity of the boundary between the optical element 10 and the substrate 20.

Inventors:
TAGAWA, Tomohiko (Inc. 2-7-2 Marunouchi, Chiyoda-k, Tokyo 15, 〒1007015, JP)
FUJIMOTO, Akihiro (Inc. 2-7-2 Marunouchi, Chiyoda-k, Tokyo 15, 〒1007015, JP)
Application Number:
JP2016/069716
Publication Date:
January 05, 2017
Filing Date:
July 01, 2016
Export Citation:
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Assignee:
KONICA MINOLTA, INC. (2-7-2 Marunouchi, Chiyoda-ku Tokyo, 15, 〒1007015, JP)
International Classes:
B29C65/02
Attorney, Agent or Firm:
FUKUDA, Mitsuhiro (Kotani Bldg. 1F, 5-3 Uchikanda 2-chome Chiyoda-ku Tokyo, 47, 〒1010047, JP)
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