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Patent Searching and Data


Title:
BONDED BODY AND METHOD FOR PRODUCING BONDED BODY
Document Type and Number:
WIPO Patent Application WO/2017/002974
Kind Code:
A1
Abstract:
A bonded body is provided with: an optical element 10 that is a first member formed from a thermoplastic resin; and a substrate 20 that is a second member formed from an inorganic material. The bonded body comprises a molecular adhesive layer 30 between the optical element 10 and the substrate 20. The optical element 10 is chemically bonded to the substrate 20 via the molecular adhesive layer 30 by melting locally with ultrasonic waves.

Inventors:
TAGAWA, Tomohiko (Inc. 2-7-2 Marunouchi, Chiyoda-k, Tokyo 15, 〒1007015, JP)
Application Number:
JP2016/069717
Publication Date:
January 05, 2017
Filing Date:
July 01, 2016
Export Citation:
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Assignee:
KONICA MINOLTA, INC. (2-7-2 Marunouchi, Chiyoda-ku Tokyo, 15, 〒1007015, JP)
International Classes:
B29C65/08
Attorney, Agent or Firm:
FUKUDA, Mitsuhiro (Kotani Bldg. 1F, 5-3 Uchikanda 2-chome Chiyoda-ku Tokyo, 47, 〒1010047, JP)
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