Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
BONDED BODY OF PIEZOELECTRIC MATERIAL SUBSTRATE AND SUPPORTING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2019/181087
Kind Code:
A1
Abstract:
[Problem] In bonding a piezoelectric material substrate formed of lithium tantalate, etc. to a supporting substrate via a silicon oxide layer, to prevent separation at the interface between silicon oxide constituting the bonding layer and the supporting substrate. [Solution] A bonded body that comprises a supporting substrate 3, a bonding layer 4 formed on a surface 3b of the supporting substrate 3, said bonding layer 4 comprising silicon oxide, and a piezoelectric material substrate formed of a material selected from the group consisting of lithium niobate, lithium tantalate and lithium niobate-lithium tantalate. A concavity 12 is formed on the surface 3b of the supporting substrate 3 and the bonding layer 4 is provided with a structural defect part 13 extending over the concavity 12.

Inventors:
HORI Yuji (2-56, Suda-cho, Mizuho-ku, Nagoya-sh, Aichi 30, 〒4678530, JP)
YAMADERA Takahiro (2-56, Suda-cho, Mizuho-ku, Nagoya-sh, Aichi 30, 〒4678530, JP)
Application Number:
JP2018/044864
Publication Date:
September 26, 2019
Filing Date:
December 06, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NGK INSULATORS, LTD. (2-56, Suda-cho Mizuho-ku, Nagoya-sh, Aichi 30, 〒4678530, JP)
International Classes:
H03H9/25; H01L41/053; H01L41/187; H01L41/313; H03H9/145
Domestic Patent References:
WO2018016314A12018-01-25
WO2017111170A12017-06-29
Foreign References:
JP2000306992A2000-11-02
JPH11307626A1999-11-05
Attorney, Agent or Firm:
HOSODA Masutoshi et al. (HAIX Hirakawacho BLDG. 4F, 10-10 HIRAKAWACHO 2-CHOME, CHIYODA-K, Tokyo 93, 〒1020093, JP)
Download PDF: