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Title:
BONDED BODY, SUBSTRATE FOR POWER MODULES, AND SUBSTRATE WITH HEAT SINK FOR POWER MODULES
Document Type and Number:
WIPO Patent Application WO/2014/142310
Kind Code:
A1
Abstract:
A bonded body which is obtained by bonding an aluminum member that is formed of aluminum and a metal member that is formed of copper, nickel or silver to each other. A Ti layer (15), which is positioned at the metal member side, and an Al-Ti-Si layer (16), which is positioned between the Ti layer (15) and the aluminum member and wherein Si is solid-solved in Al3Ti, are formed in the bonded portion between the aluminum member and the metal member. The Al-Ti-Si layer (16) is provided with a first Al-Ti-Si layer (16A) that is formed on the Ti layer (15) side, and a second Al-Ti-Si layer (16B) that is formed on the aluminum member side and has a lower Si concentration than the first Al-Ti-Si layer (16A).

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Inventors:
TERASAKI NOBUYUKI (JP)
NAGATOMO YOSHIYUKI (JP)
Application Number:
PCT/JP2014/056920
Publication Date:
September 18, 2014
Filing Date:
March 14, 2014
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
B32B15/01; B23K20/00; H01L23/12; H01L23/36
Foreign References:
JP2012104539A2012-05-31
JPH06328271A1994-11-29
JP2014087805A2014-05-15
JP3171234B22001-05-28
JP2004172378A2004-06-17
JP2008208442A2008-09-11
JP3012835B22000-02-28
Other References:
See also references of EP 2974859A4
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
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