Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
BONDED MATERIAL AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2014/119803
Kind Code:
A1
Abstract:
The main purpose of the present invention is to provide: a bonded material in which the thickness of a metal layer can be increased and the bonding between the metal layer and a carbon material layer can be achieved easily, and which is rarely broken; and a method for producing the bonded material. A bonded material having such a structure that a CFC layer (3) is bonded to a tungsten layer (4), said bonded material being characterized in that a sintered tungsten carbide layer (5), a SiC-WC mixed layer (6) and sintered SiC and sintered WC (7) both buried in the CFC layer are formed between the CFC layer (3) and the tungsten layer (4), and the layers (3), (4), (5), (6) and (7) are bonded together by a sintering method.

Inventors:
MIYAMOTO YOSHINARI (JP)
FUJITA ICHIRO (JP)
DOI MEGUMU (JP)
MATSUMOTO TAIHEI (JP)
OHKUNI TOMOYUKI (JP)
NAKAMURA FUMISHIGE (JP)
CHEN WEIWU (JP)
Application Number:
PCT/JP2014/052811
Publication Date:
August 07, 2014
Filing Date:
January 30, 2014
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOYO TANSO CO (JP)
International Classes:
C04B37/02; B23K20/00; B32B15/04; C04B41/87
Domestic Patent References:
WO2013172286A12013-11-21
Foreign References:
JP2012246173A2012-12-13
JPS6278167A1987-04-10
JPH1149569A1999-02-23
JPS6236076A1987-02-17
JPS5722179A1982-02-05
JPH1090453A1998-04-10
JP2000313677A2000-11-14
Other References:
See also references of EP 2952496A4
Attorney, Agent or Firm:
KITADAI, Tetsuo et al. (JP)
Tetsuo Kitadai (JP)
Download PDF: