Title:
BONDED MATERIAL, AND PROCESS FOR PRODUCTION THEREOF
Document Type and Number:
WIPO Patent Application WO/2011/162137
Kind Code:
A1
Abstract:
Disclosed is a process for producing a bonded material in which a first circuit member and a second circuit member are electrically bonded to each other through an anisotropic conductive film comprising electrically conductive particles and a photocurable resin. The process comprises the steps of: arranging the first circuit member, the anisotropic conductive film and the second circuit member in this order; pressure-welding the first circuit member to the second circuit member through the anisotropic conductive film while applying an ultrasonic wave; and, subsequent to the application of the ultrasonic wave, irradiating the anisotropic conductive film with light while carrying out the pressure-welding of the first circuit member to the second circuit member through the anisotropic conductive film.
Inventors:
ISHIMATSU, Tomoyuki (1078 Kamiishikawa, Kanuma-sh, Tochigi 15, 〒3220015, JP)
Application Number:
JP2011/063643
Publication Date:
December 29, 2011
Filing Date:
June 15, 2011
Export Citation:
Assignee:
Sony Chemical & Information Device Corporation (Gate City Osaki, East Tower 8th Floor 11-2, Osaki 1-chome, Shinagawa-k, Tokyo 32, 〒1410032, JP)
ソニーケミカル＆インフォメーションデバイス株式会社 (〒32 東京都品川区大崎一丁目１１番２号 ゲートシティ大崎イーストタワー８階 Tokyo, 〒1410032, JP)
ソニーケミカル＆インフォメーションデバイス株式会社 (〒32 東京都品川区大崎一丁目１１番２号 ゲートシティ大崎イーストタワー８階 Tokyo, 〒1410032, JP)
International Classes:
H05K1/14; H01B1/22; H01B5/16; H01B13/00; H01R43/00; H05K3/32
Attorney, Agent or Firm:
HIROTA, Koichi et al. (HIROTA, NAGARE & ASSOCIATES 4th Floor, Shinjuku TR Bldg., 2-2-13, Yoyogi, Shibuya-k, Tokyo 53, 〒1510053, JP)
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Claims: