Title:
BONDED STRUCTURE MANUFACTURING METHOD AND BONDED STRUCTURE MANUFACTURING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2017/188212
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a bonded structure manufacturing method and a bonded structure manufacturing apparatus with which a secure bonded state can be obtained and reduction in bonding strength over time can be avoided. In the present invention, organic substances, which are inevitably formed on the bonding surface of a first bonding material and/or a second bonding material as a result of performing surface modification to improve the wettability of the surface that will be a bonding surface, are removed by an organic substance-removing treatment. A bonded structure obtained by bonding the first bonding material with the second bonding material is manufactured by overlaying the first bonding material and the second bonding material so that the respective surfaces to be bonded adhere closely and performing a bonding treatment.
Inventors:
MATSUZAWA SATOSHI (JP)
Application Number:
PCT/JP2017/016278
Publication Date:
November 02, 2017
Filing Date:
April 25, 2017
Export Citation:
Assignee:
USHIO ELECTRIC INC (JP)
International Classes:
B29C65/00; G02B5/30
Domestic Patent References:
| WO2005085918A1 | 2005-09-15 |
Foreign References:
| JP2008122502A | 2008-05-29 |
Attorney, Agent or Firm:
OHI, Masahiko (JP)
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