BONDED STRUCTURE, ROOF STRUCTURE, LAMINATED SHEET FOR USE THEREIN, AND METHOD OF USING LAMINATED SHEET

WIPO Patent Application WO/2010/044311

A1

Provided is a bonded structure obtained by bonding a member to another member with a laminated sheet.  When the bonded structure is heated, a shrinkable film as a component of the laminated sheet shrinks to separate the laminated sheet from one of the members, whereby the bonded structure is prevented from deforming.  Also provided is a roof structure.  A laminated sheet for use in the bonded structure is furthermore provided which comprises a shrinkable film and a release layer superposed in this order.  The release layer is bonded to one of two members.  When the bonded structure is heated, the bonded structure is separated at the interface between the release layer and the member.  A method of using the laminated sheet is still further provided which comprises applying the release-layer side of the laminated sheet to one side of one of two members and bonding the shrinkable-film side of the laminated sheet to the other member with an adhesive to thereby bond the members to each other.  The bonded structure and the roof structure can be released from the bonded state when heated.

YAGUCHI SHIGEYUKI (JP)
SHIGEOKA HIROFUMI (JP)
TOMINO TADAHIRO (JP)
HORIGUCHI YOHEI (JP)

PCT/JP2009/064519

April 22, 2010

August 19, 2009

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HONDA MOTOR CO LTD (JP)
LINTEC CORP (JP)
YAGUCHI SHIGEYUKI (JP)
SHIGEOKA HIROFUMI (JP)
TOMINO TADAHIRO (JP)
HORIGUCHI YOHEI (JP)

B32B7/06; B62D25/06; B62D29/04; C09J7/02

JP2000319600A	2000-11-21
JP2008062696A	2008-03-21
JPH06182920A	1994-07-05
JPS5898250A	1983-06-11
JP2005193871A	2005-07-21

OHTANI, Tamotsu (JP)
Tamotsu Otani (JP)

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