Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
BONDED SUBSTRATE, SURFACE ACOUSTIC WAVE ELEMENT, SURFACE ACOUSTIC WAVE ELEMENT DEVICE, AND BONDED SUBSTRATE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/230442
Kind Code:
A1
Abstract:
This bonded substrate comprises a quartz substrate, and a piezoelectric substrate which is bonded onto the quartz substrate and on which a surface acoustic wave propagates, the bonding comprising a covalent bonding at a bonding interface. The orientation of the quartz substrate and the orientation of the piezoelectric substrate intersect each other in orthogonal directions or in a range of 65 degrees to 115 degrees in the direction of the plane of bonding.

Inventors:
KURIMOTO KOUHEI (JP)
KISHIDA KAZUHITO (JP)
KAYANO RINZO (JP)
KAKIO SHOJI (JP)
MIZUNO JUN (JP)
Application Number:
PCT/JP2018/021898
Publication Date:
December 20, 2018
Filing Date:
June 07, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
JAPAN STEEL WORKS LTD (JP)
UNIV WASEDA (JP)
UNIV YAMANASHI (JP)
KURIMOTO KOUHEI (JP)
KISHIDA KAZUHITO (JP)
KAYANO RINZO (JP)
KAKIO SHOJI (JP)
International Classes:
H03H9/25; H03H3/10
Domestic Patent References:
WO2009081651A12009-07-02
WO2013031651A12013-03-07
WO2018097016A12018-05-31
Foreign References:
JPH10178331A1998-06-30
JPH11122073A1999-04-30
JP2005252550A2005-09-15
JP3187231U2013-11-14
JPH09208399A1997-08-12
JPH07154177A1995-06-16
JP2008060382A2008-03-13
JP2002009567A2002-01-11
JP2017046033A2017-03-02
JP2018026695A2018-02-15
Attorney, Agent or Firm:
YOKOI Koki (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: CONVEYANCE DEVICE AND CONVEYANCE METHOD

Next Patent: SIMULATION SYSTEM, IMAGE PROCESSING METHOD, AND INFORMATION STORAGE MEDIUM