Title:
BONDED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2022/071184
Kind Code:
A1
Abstract:
A bonded substrate according to the present disclosure includes: a support substrate formed of monocrystals of silicon; a piezoelectric substrate formed of monocrystals of lithium tantalate or monocrystals of lithium niobate; and a bond layer for bonding the support substrate and the piezoelectric substrate. The bond layer is an amorphous bond layer that contains carbon and, as main components, silicon and a constituting element of the piezoelectric substrate.
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Inventors:
NARAHARA YOSHIHIDE (JP)
KAJIHARA MITSUHIRO (JP)
KAJIHARA MITSUHIRO (JP)
Application Number:
PCT/JP2021/035265
Publication Date:
April 07, 2022
Filing Date:
September 27, 2021
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L21/02; H03H9/25
Domestic Patent References:
| WO2014077213A1 | 2014-05-22 |
Foreign References:
| JP2020078047A | 2020-05-21 |
Attorney, Agent or Firm:
BUNA PATENT ATTORNEYS (JP)
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