Title:
BONDING APPARATUS AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/058220
Kind Code:
A1
Abstract:
[Problem] To more easily bond a cut sheet member to a workpiece. [Solution] A laminator 1 supplies a workpiece 100 to be processed and an upper film 200 and a lower film 300 to be bonded to the workpiece 100 and bonds the upper film 200 and the lower film 300 to the workpiece 100. The laminator 1 detects the misaligned state of the workpiece 100 before bonding thereof. The laminator 1 processes the upper film 200 and the lower film 300 supplied in advance based on the detection results so that the cutting positions correspond to the misaligned state of the workpiece 100. When bonding the sheet members to the workpiece 100, the laminator arranges the cutting positions of the upper film 200 and the lower film 300 supplied to match the misaligned state of the workpiece 100.
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Inventors:
YOSHIDA YUTA (JP)
Application Number:
PCT/JP2023/033400
Publication Date:
March 21, 2024
Filing Date:
September 13, 2023
Export Citation:
Assignee:
MCK CO LTD (JP)
International Classes:
B29C63/02
Foreign References:
| JP2018069615A | 2018-05-10 | |||
| JP2017032739A | 2017-02-09 | |||
| JP2016055506A | 2016-04-21 |
Attorney, Agent or Firm:
BONO Yasuhiro (JP)
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