Title:
BONDING COMPOSITION, AND BOARD
Document Type and Number:
WIPO Patent Application WO/2015/056367
Kind Code:
A1
Abstract:
The present invention discloses a bonding composition that is cured by heating and pressurizing. The bonding composition contains a sugar-containing substance generated when a sugar is produced. The sugar-containing substance contains a sugar component and potassium. The bonding composition contains an organic sulfonic acid. The content of the organic sulfonic acid is 2-100 parts by mass relative to 100 parts by mass of solid content in the sugar component. A board can be obtained by bonding plant pieces by means of the bonding composition.
Inventors:
SUGAWARA RYO
Application Number:
PCT/JP2014/002469
Publication Date:
April 23, 2015
Filing Date:
May 09, 2014
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C09J105/00; B27N3/00; C09J11/06
Domestic Patent References:
| WO2010001988A1 | 2010-01-07 | |||
| WO2013190777A1 | 2013-12-27 |
Foreign References:
| JPS5831112B2 | 1983-07-04 | |||
| JP2002361611A | 2002-12-18 | |||
| US4524164A | 1985-06-18 |
Attorney, Agent or Firm:
NISHIKAWA, Yoshikiyo et al. (JP)
Yoshikiyo Nishikawa (JP)
Yoshikiyo Nishikawa (JP)
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