BONDING COMPOSITION AND METAL BONDED BODY USING SAME

Title:

BONDING COMPOSITION AND METAL BONDED BODY USING SAME

Document Type and Number:

WIPO Patent Application WO/2015/159480

Kind Code:

A1

Abstract:

Provided are: a bonding composition which is mainly composed of inorganic particles and is capable of providing a metal bonded body that has high shear strength and long-term reliability; and a metal bonded body using the bonding composition. The present invention relates to a bonding composition which contains inorganic particles and an organic component, and which is characterized in that the sulfur content in the bonding composition is 10% by atom or less relative to the total amount of the inorganic particles and the sulfur.

More Like This:

WO/2015/091783	METHOD FOR PRODUCING A NANOWIRE TOP ELECTRODE FOR OPTOELECTRONIC COMPONENTS AND USE THEREOF
WO/2012/099161	METAL PARTICLE POWDER AND PASTE COMPOSITION USING SAME
WO/2005/042794	TRIANGULAR NANOFRAMES AND METHODS OF MAKING SAME

Inventors:

SHIMOYAMA KENJI (JP)
TAKESUE MASAFUMI (JP)

Application Number:

PCT/JP2015/001320

Publication Date:

October 22, 2015

Filing Date:

March 11, 2015

Export Citation:

Click for automatic bibliography generation Help

Assignee:

BANDO CHEMICAL IND (JP)

International Classes:

B22F1/0545; B23K35/30; C04B37/00

Foreign References:

JP2013159830A	2013-08-19
JP2011068988A	2011-04-07

Other References: