Title:
BONDING COMPOSITION AND METHOD FOR PREPARING SAME
Document Type and Number:
WIPO Patent Application WO/2018/030173
Kind Code:
A1
Abstract:
Provided is a bonding composition for obtaining a bonded layer which has a low void rate and a high bonding strength, and excellent heat-resistant reliability, regardless of whether baking is performed in the atmosphere or in an inert atmosphere, and whether plated or unplated substrates are bonded. The bonding composition of the present invention is characterized by including silver nanoparticles, a dispersion medium, and a first carboxylic acid which is attached to at least a portion of the surfaces of the silver nanoparticles and includes an O atom in a carbon chain.
Inventors:
KUBOTA SHIGEKI (JP)
NAKAJIMA NAOYA (JP)
NAKAJIMA NAOYA (JP)
Application Number:
PCT/JP2017/027390
Publication Date:
February 15, 2018
Filing Date:
July 28, 2017
Export Citation:
Assignee:
BANDO CHEMICAL IND (JP)
International Classes:
B22F1/00; B22F1/102; B22F7/04; B22F9/24; H01B1/00; H01B1/22; H01B5/00; H01B13/00
Domestic Patent References:
| WO2015190076A1 | 2015-12-17 | |||
| WO2016067599A1 | 2016-05-06 | |||
| WO2014204013A1 | 2014-12-24 |
Foreign References:
| JP2011038128A | 2011-02-24 |
Attorney, Agent or Firm:
NAKA Koichi et al. (JP)
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