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Patent Searching and Data


Title:
BONDING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/121296
Kind Code:
A1
Abstract:
Provided is a bonding composition with which it is possible to suppress fillet formation while maintaining sufficient spread to the bonding interface together with obtaining high bonding strength by bonding at a relatively low temperature. The present invention provides a bonding composition containing inorganic particles and organic components, wherein the bonding composition is characterized in that: the average grain size of the inorganic particles is 1-200 nm; the viscosity at approximately 25°C is 10-30 Pa・s at a shear speed of 10 s-1; and the thixotropic ratio, defined as the value obtained by dividing the viscosity at approximately 25°C when measured at a shear speed of 1 s-1 by the viscosity at approximately 25°C when measured at a shear speed of 10 s-1, is 3-7.

Inventors:
NAKAJIMA NAOYA (JP)
MATSUI MIKI (JP)
SHIMOYAMA KENJI (JP)
Application Number:
PCT/JP2016/000016
Publication Date:
August 04, 2016
Filing Date:
January 05, 2016
Export Citation:
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Assignee:
BANDO CHEMICAL IND (JP)
International Classes:
C09J1/00; C09J9/02; H01B1/22; H01L21/52; H01L33/48
Domestic Patent References:
WO2013061527A12013-05-02
WO2011155615A12011-12-15
Foreign References:
JP2012052029A2012-03-15
JP2014088516A2014-05-15
JP2000136368A2000-05-16
Attorney, Agent or Firm:
NAKA, Koichi et al. (JP)
Relations Koichi (JP)
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