Title:
BONDING DEVICE AND BONDED SUBSTRATE MANUFACTURED USING SAME
Document Type and Number:
WIPO Patent Application WO/2013/051395
Kind Code:
A1
Abstract:
A bonding device (20) according to an embodiment of the present invention is provided with: a transporting film (7) which is elastic and on which an Si wafer (1) can be disposed; a chamber (6) which is divided into a bonding chamber (9) and an adjoining chamber (10), the bonding chamber (9) being configured to bond the Si wafer (1) to a glass substrate (2); and a pressure change means which decreases the pressure in the bonding chamber (9) to cause the transporting film (7) to extend so that the Si wafer (1) is brought into contact with the glass substrate (2).
Inventors:
SUGA KATSUYUKI
Application Number:
PCT/JP2012/073952
Publication Date:
April 11, 2013
Filing Date:
September 19, 2012
Export Citation:
Assignee:
SHARP KK (JP)
SUGA KATSUYUKI
SUGA KATSUYUKI
International Classes:
H01L21/02; H01L21/677; H01L27/12
Foreign References:
| JP2007235114A | 2007-09-13 | |||
| JP2009231819A | 2009-10-08 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
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