Title:
BONDING DEVICE, DIE BONDER AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/100771
Kind Code:
A1
Abstract:
A bonding device which bonds a workpiece to a supplied member via an adhesive and is equipped with a heating means for heating the supplied member in a bonding location where the workpiece is bonded to the supplied member, the bonding device being equipped with a control means in which the supplied member temperature at which workpiece bonding is possible is set, and a temperature measurement means for measuring the temperature of the supplied member. The workpiece is bonded to the supplied member in a state where the temperature of the supplied member has reached the temperature set by the control means.
Inventors:
NAGAMOTO NOBUHIRO (JP)
Application Number:
PCT/JP2019/044001
Publication Date:
May 22, 2020
Filing Date:
November 08, 2019
Export Citation:
Assignee:
CANON MACHINERY INC (JP)
International Classes:
H01L21/52; H05K13/04
Foreign References:
| JPH0414843A | 1992-01-20 | |||
| JP2010225956A | 2010-10-07 | |||
| JP2014225563A | 2014-12-04 |
Attorney, Agent or Firm:
SHIROMURA Kunihiko et al. (JP)
Download PDF:
Previous Patent: INFORMATION PROCESSING SYSTEM, INFORMATION PROCESSING METHOD, AND PROGRAM
Next Patent: REACTOR
Next Patent: REACTOR