Title:
BONDING DEVICE, BONDING METHOD AND BONDING CONTROL PROGRAM
Document Type and Number:
WIPO Patent Application WO/2017/208525
Kind Code:
A1
Abstract:
The objective of the invention is to perform bonding processing with respect to a plurality of bonding positions, where the respective distances to a reference (origin) position of a component to be bonded are different, without changing the moving distance of bonding means.
The invention comprises: the bonding means; a bonding stage having a work-holder and a rotation mechanism unit rotating the work-holder; and a control unit controlling the rotation of the work-holder. The bonding means is provided so as to be movable relative to a carrying surface of the work-holder in a reference orientation, and has a reference position in the movement direction. The plurality of bonding points include bonding points whereof the separation distances from the reference position along the movement direction are different when the component to be bonded is in the held state by the work-holder in the reference orientation. The control unit controls the rotation of the work-holder in order to correcting for the differences in the separation distances of the plurality of bonding points.
Inventors:
KOMAGINO YUJI (JP)
YAMAGUCHI HODAKA (JP)
YOSHINO HIDEKI (JP)
YAMAGUCHI HODAKA (JP)
YOSHINO HIDEKI (JP)
Application Number:
PCT/JP2017/006583
Publication Date:
December 07, 2017
Filing Date:
February 22, 2017
Export Citation:
Assignee:
KAIJO KK (JP)
International Classes:
H01L21/60; B23K20/00
Foreign References:
| JP2001267674A | 2001-09-28 | |||
| JPH088287A | 1996-01-12 |
Attorney, Agent or Firm:
HAGIRI, Masaharu et al. (JP)
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