Title:
BONDING DEVICE, BONDING METHOD, AND DISPLAY DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2020/246339
Kind Code:
A1
Abstract:
The present invention can pressurize an entire surface substantially uniformly, in a highly precisely positioned state. A substantially planar first suction section suctions a substantially planar first member thereto, a substantially planar second suction section provided on the upper side, in the vertical direction, of the first suction section suctions a transparent and substantially planar second member thereto, and the two members are bonded together. The second suction section is a substantially tubular member having both ends thereof covered. The lower surface of the second suction section is a transparent suction pad having a throughhole formed therein that penetrates in the thickness direction. The second member is suctioned to the suction pad by air being drawn into the throughhole through a suction port. The surface on the upper side of the second suction section has at least part thereof formed from a transparent member. An imaging unit provided on the upper side of the second suction section in the vertical direction captures an image of the first member and/or the second member via the transparent member and the suction pad.
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Inventors:
YANAGAWA YOSHIKATSU (JP)
HIRANO TAKAFUMI (JP)
OKURA NAOYA (JP)
HIRANO TAKAFUMI (JP)
OKURA NAOYA (JP)
Application Number:
PCT/JP2020/020943
Publication Date:
December 10, 2020
Filing Date:
May 27, 2020
Export Citation:
Assignee:
V TECH CO LTD (JP)
International Classes:
H01L21/52; H05K13/04
Domestic Patent References:
WO2009025016A1 | 2009-02-26 | |||
WO2011145278A1 | 2011-11-24 |
Foreign References:
JP2009295853A | 2009-12-17 | |||
JP2011009655A | 2011-01-13 | |||
JP2017157682A | 2017-09-07 | |||
JPH02224951A | 1990-09-06 | |||
JP2011009654A | 2011-01-13 | |||
JP2019015899A | 2019-01-31 | |||
JP2000183404A | 2000-06-30 | |||
JP2012227201A | 2012-11-15 |
Attorney, Agent or Firm:
SAKATA Yukari (JP)
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