Title:
BONDING DEVICE, BONDING SYSTEM AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/137002
Kind Code:
A1
Abstract:
The present invention is a bonding device which bonds substrates with each other by means of intermolecular force, and which comprises: a first holding member that sucks and holds a first substrate on the lower surface by evacuation; and a second holding member that is arranged below the first holding member, and sucks and holds a second substrate on the upper surface by evacuation. The first holding member and/or the second holding member has a heating mechanism that heats the first substrate and/or the second substrate to a predetermined temperature. Consequently, this bonding device is capable of adequately bonding the substrates with each other by means of intermolecular force, while suppressing the generation of air bubbles in the outer peripheral portion between the substrates.
Inventors:
KITAHARA SHIGENORI (JP)
TANAKA YOSHIHIRO (JP)
HAYASHI HIROSHI (JP)
TANAKA YOSHIHIRO (JP)
HAYASHI HIROSHI (JP)
Application Number:
PCT/JP2013/055397
Publication Date:
September 19, 2013
Filing Date:
February 28, 2013
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/02; B23K20/00; H01L21/683
Foreign References:
| JP2006339363A | 2006-12-14 | |||
| JP2007103225A | 2007-04-19 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
Tetsuo Kanamoto (JP)
Tetsuo Kanamoto (JP)
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