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Title:
BONDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/209269
Kind Code:
A1
Abstract:
This bonding device 1 is provided with: a tape feeder module 10 which takes out an electronic component 301 from a carrier tape 13 and transfers the electronic component 301 thus taken out; a die supply module 20 which has a die pick-up mechanism 21 for picking up a semiconductor die 201 from a semiconductor wafer 200 bonded to a dicing sheet 22a by pushing up the semiconductor die 201 and which transfers the semiconductor die 201 thus picked up; and a bonding module 40 which disposes, on a circuit substrate 101, the semiconductor die 201 provided by the die supply module 20 and/or the electronic component 301 provided by the tape feeder module 10.

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Inventors:
SEKIGUCHI SHIGEYUKI (JP)
EGUCHI YUJI (JP)
SEYAMA KOHEI (JP)
Application Number:
PCT/JP2020/015746
Publication Date:
October 15, 2020
Filing Date:
April 07, 2020
Export Citation:
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Assignee:
SHINKAWA KK (JP)
International Classes:
H01L21/52; H01L21/60; H05K13/04
Domestic Patent References:
WO2014049833A12014-04-03
WO2017119217A12017-07-13
Foreign References:
JP2016031975A2016-03-07
JP2012019189A2012-01-26
JP2011035178A2011-02-17
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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