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Title:
BONDING FILM FOR SEMICONDUCTORS AND BONDING SHEET FOR SEMICONDUCTORS
Document Type and Number:
WIPO Patent Application WO/2019/022062
Kind Code:
A1
Abstract:
Provided is a bonding film for semiconductors, which contains a thermosetting adhesive and from 25% by mass to 80% by mass (inclusive) of a barium titanate filler.

Inventors:
TANAKA YUYA (JP)
SATO YOSUKE (JP)
Application Number:
PCT/JP2018/027650
Publication Date:
January 31, 2019
Filing Date:
July 24, 2018
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Assignee:
LINTEC CORP (JP)
International Classes:
C09J7/35; C09J7/10; C09J11/04; C09J201/00; G01B7/28
Foreign References:
JP2017014406A2017-01-19
JP2008094993A2008-04-24
JP2008010821A2008-01-17
JP2002309200A2002-10-23
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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