Title:
BONDING JIG AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/136159
Kind Code:
A1
Abstract:
A bonding jig according to the present invention is for bonding, by pressure bonding to a member to be bonded, first and second members constituting an alleviation member. This bonding jig comprises: a first bonding member that holds a first member; a second bonding member that holds a second member, and that, by being put onto the first bonding member, pressure bonds the first and second members to the member to be bonded; and a switching mechanism that switches, in a space where the first bonding member holds the first member, between a first state in which a gap is formed between the first bonding member and a portion of a side surface that extends to the pressure-bonded surfaces of the first member and the second member, and a second state in which the gap is filled and the position of the first member is regulated.
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Inventors:
KAJIGAYA SUGURU (JP)
FUJIWARA YUUKI (JP)
FUJIWARA YUUKI (JP)
Application Number:
PCT/JP2022/048488
Publication Date:
July 20, 2023
Filing Date:
December 28, 2022
Export Citation:
Assignee:
NHK SPRING CO LTD (JP)
International Classes:
B60G21/055
Foreign References:
| JP2008143376A | 2008-06-26 | |||
| JP2020083128A | 2020-06-04 | |||
| JP2006170292A | 2006-06-29 | |||
| KR101941858B1 | 2019-01-24 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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