Title:
BONDING JUNCTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/057645
Kind Code:
A1
Abstract:
Provided is a bonding junction structure that joins a heating body and a metal support (20) via a junction site (30) comprising a copper powder (31) sintered body (32). Copper or gold exist in at least the outermost surface of the support (20). An interdiffusion site (41) is formed between the copper or gold of the support (20) and the copper of the sintered body (32) so as to straddle the junction interface (40) between the support (20) and the sintered body (32). It is preferable for copper crystal structures for which the crystal orientation is in the same direction to be formed in the interdiffusion site (41) so as to straddle the junction interface (40).
Inventors:
KAMIKORIYAMA YOICHI (JP)
YAMAUCHI SHINICHI (JP)
YAMAUCHI SHINICHI (JP)
Application Number:
PCT/JP2016/078946
Publication Date:
April 06, 2017
Filing Date:
September 29, 2016
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
H01L21/52; B22F7/08
Foreign References:
| JP2008244242A | 2008-10-09 | |||
| JP2010050189A | 2010-03-04 | |||
| JP2016032051A | 2016-03-07 |
Other References:
See also references of EP 3358610A4
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
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