Title:
BONDING KIT, BONDING METHOD, AND BONDED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/054211
Kind Code:
A1
Abstract:
A bonding kit that comprises: a pressure-sensitive adhesive layer (1) comprising an epoxy resin and an elastomer; and a liquid hardener composition (3) which, when brought into contact with the pressure-sensitive adhesive layer (1), can react with and thereby cure the pressure-sensitive adhesive layer (1). The pressure-sensitive adhesive layer (1) contains 1-30 mass% the elastomer.
Inventors:
SUZUKI YUTO (JP)
TANAKA AKIKO (JP)
TANAKA AKIKO (JP)
Application Number:
PCT/JP2022/035545
Publication Date:
April 06, 2023
Filing Date:
September 22, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B27/00; B32B7/022; B32B27/26; C09J5/04; C09J11/08; C09J163/00
Foreign References:
| JP2016050224A | 2016-04-11 | |||
| JP2017088723A | 2017-05-25 | |||
| JP2019172744A | 2019-10-10 | |||
| JP2018172642A | 2018-11-08 | |||
| JP2021107126A | 2021-07-29 | |||
| JPS57139160A | 1982-08-27 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
Download PDF: