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Title:
BONDING MATERIAL CONTAINING METAL NANOPARTICLES
Document Type and Number:
WIPO Patent Application WO/2015/098658
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a material that achieves sufficient bonding strength at a low bonding temperature without application of a pressure. This problem is solved by providing a bonding material which is characterized by containing: metal nanoparticles (B) to which a polyethylene glycol-containing organic compound (A) having 8-200 carbon atoms is complexed; and at least one solvent (C) selected from the group consisting of an alcohol solvent having a boiling point of 150°C or more, an ether solvent having a boiling point of 150°C or more, an ester solvent having a boiling point of 150°C or more and a lactam structure-containing solvent having a boiling point of 150°C or more.

Inventors:
NAGATA HIROHITO (JP)
MORIWAKI MASAYUKI (JP)
SANO YOSHIYUKI (JP)
KAWAMURA KAORI (JP)
Application Number:
PCT/JP2014/083442
Publication Date:
July 02, 2015
Filing Date:
December 17, 2014
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
B22F9/00; B22F1/054; B82Y30/00; B82Y40/00; C08G65/334; C09J1/00; C09J11/06; H01B1/00; H01B1/22
Domestic Patent References:
WO2011155055A12011-12-15
Foreign References:
JP5077728B12012-11-21
JP4697356B12011-06-08
JP2013060637A2013-04-04
JP2012023014A2012-02-02
Attorney, Agent or Firm:
KONO MICHIHIRO (JP)
Michihiro Kono (JP)
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