Title:
BONDING MATERIAL, METHOD FOR PRODUCING BONDING MATERIAL, AND BONDED BODY
Document Type and Number:
WIPO Patent Application WO/2021/149496
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a bonding material which enables the achievement of excellently reliable bonding; and the present invention provides a plate-like or sheet-like bonding material which contains fine copper particles having an average particle diameter of 300 nm or less, coarse copper particles having an average particle diameter of from 3 μm to 11 μm, and a reducing agent which reduces the fine copper particles and the coarse copper particles.
Inventors:
MIYOSHI KENTARO (JP)
IGARASHI HIROSHI (JP)
IGARASHI HIROSHI (JP)
Application Number:
PCT/JP2021/000286
Publication Date:
July 29, 2021
Filing Date:
January 07, 2021
Export Citation:
Assignee:
TAIYO NIPPON SANSO CORP (JP)
International Classes:
B22F1/00; B22F7/08
Foreign References:
| JP2014036125A | 2014-02-24 | |||
| JP2019203172A | 2019-11-28 |
Attorney, Agent or Firm:
SHIGA INTERNATIONAL PATENT OFFICE (JP)
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